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Thermal Conductive Insulator Materials

Brand Name: SinoGuide
Model Number: I160F
Material: Silicone&Ceramic
Thermal Conductivity: 1.6W/m.k
Material Details：Acrylic, Silicone Free Thermal Pad, Thermally Conductive Insulator Interface Pad

This high performance thermal pad has thermal conductivity similar to thermal grease but without the mess. A thermal pad is used between a module’s baseplate and an attached heat sink to minimize the thermal impedance between them.

Products Features:

◇Thermally conductive insulators are designed to be clean, grease-free, flexible and convenient assembly .The combination of a tough carrier material such as fiberglass or Polyimide and silicone rubber which is conformable, minimize the thermal resistance from the case of a power semiconductor such as MOSFET to the heat sink.

◇All TCI materials electrically isolate the semiconductor from the heat sink and have sufficient dielectric strength to withstand high voltage. They are also strong enough to resist puncture by the facing metal surface by screw driver and clip mounted application
◇Excellent Reliability

Typical Applications Include:

--Between high power component (such as MOSFET) and heatsink for screw and clip mounted application
--Graphic Processor Unit
--Power Semiconductors
--Digital/High Power CPU's

Typical Properties of This Materials:

Typical Properties of Thermal Conductive Insulator
Properties	Units	TCI160F	TCIK10	TCI160	Test Method
Carrier	---	Fiberglass	Fiberglass	NA	Visual
Color	---	Grey/Pink	Beige	Black	Visual
Thickness	mm	0.229,0.3,0.45	0.16	0.2~0.80	---
Hardness	Shore A	80	80	80	ASTM D2240
Density(g/cm)	---	2.2	2.3	2.0	ASTM D792
Thermal Resistance	@50psi (℃-in2/W)	0.021	0.014	0.009	ASTM D5470
Temperature Range	℃	-50 to 200			EN344
Breakdown Voltage	KV	≥4.8	≥5.0	≥5.0	ASTM D149
Dielectric Constant	60 HZ	3.6	3.75	6.6	ASTM D150
Dielectric Constant	1K Hz	3.5	3.7	6.6	ASTM D150
Dielectric Constant	1M Hz	3.5	1.8	6.6	ASTM D150
Thermal Conductivity	W/m.k	1.6	1.3	1.6	ASTM D5470