In computing and electronics, thermal pads (also called thermally conductive pads or thermal interface pads) are a pre-formed square or rectangle of solid material (often ceramic or silicone based) commonly found on the underside of heat sinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminum or copper).

The SinoGuide™ Thermally Conductive Pads are available in acrylic, where a non-silicone base material is desired. The pads are designed in a variety of thermal conductivities and softness grades to provide excellent gap filling, low assembled stress and a high degree of wet-out for a more efficient heat transfer.

Typical Properties of This Materials:

Note: Standard Roll Form: 300mm(W) x 50m (L) or 76M (L) , Custom configuration Available

Below info will be helpful for your right application

How to transfer or dissipate the heat from the heat-generating components to heat sinks?

How To Select the Right Thermal Interface Materials for your new application?

Pls feel free to contact us as Thermal Management Solutions available in SinoGuide.