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  • Acrylic Silicone Free Thermal Pad
Acrylic Silicone Free Thermal Pad

Acrylic Silicone Free Thermal Pad

  • Brand Name: SinoGuide
  • Model Number: TCSF200
  • Material: Acrylic&Ceramic
  • Thermal Conductivity: 2.0 W/m.k
  • Material Details:Thermal Pad: Ultra-Soft Silicone Free from SinoGuide; 2.00 W/mk thermal conductivity; Naturally tacky for easy applicaiton; Electrically insulating. MATERIAL HIGHLIGHT: SinoGuide™ THERMALLY CONDUCTIVE
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In computing and electronics, thermal pads (also called thermally conductive pads or thermal interface pads) are a pre-formed square or rectangle of solid material (often ceramic or silicone based) commonly found on the underside of heat sinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminum or copper).

The SinoGuide™ Thermally Conductive Pads are available in acrylic, where a non-silicone base material is desired. The pads are designed in a variety of thermal conductivities and softness grades to provide excellent gap filling, low assembled stress and a high degree of wet-out for a more efficient heat transfer.

Products Features:

2.00 W/mk thermal conductivity
Silicone-Free Thermal Pad
Naturally tacky for easy applicaiton
Electrically insulating

Typical Applications Include:

--Network Equipement, Mass Storage devices
--Industrial Automation, Telecom Device
--Smart TV Stick, Wireless Hub,Flat Panel displays, Power supply.

Typical Properties of This Materials:

Typical Properties of TCSF200 Silicone-Free Thermal Conductive Pad
Properties Units TCSF200 Series Test Method
Material --- Acrylic ---
Color --- Grey Visual
Thickness mm 0.5 to 5 ---
Hardness Shore 00 60 ASTM D2240
Density g/cc 3.13 ASTM D792
Heat Capacity 1/g-K 1.1 ASTM E1269
Outgassing TML --- 0.12% ASTM E595
Outgassing CVCM --- 0.06% ASTM E595
Continuous Use Temp -60 to 200 EN344
Dielectric Breakdown Voltage Vac ≥200 Vac/mil ASTM D149
Volume Impedance ohm-cm 6.0 x109 ASTM D257
Flame Rating V 0 UL 94
Thermal Conductivity W/m.k 2.0 ASTM D5470

Note: Standard Roll Form: 300mm(W) x 50m (L) or 76M (L) , Custom configuration Available

Below info will be helpful for your right application

How to transfer or dissipate the heat from the heat-generating components to heat sinks?

How To Select the Right Thermal Interface Materials for your new application?

Pls feel free to contact us as Thermal Management Solutions available in SinoGuide.

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