Thermal interface material (TIM) is a key component in the majority of power electronic systems. Heat, generated by the semiconductors, has to be transferred to a heat sink and finally dissipated to ambient. Increasing electronic device performance has historically been accompanied by increasing power and increasing on-chip power density both of which present a cooling challenge. Thermal Interface Material (TIM) plays a key role in reducing the package thermal resistance and the thermal resistance between the electronic device and the external cooling components.

SinoGuide offers a variety of thermally conductive gap filler materials in many formats including silicone, non-silicone, pads, putty and dispensable. SinoGuide Gap Filler materials offer a range of thermal conductivities, hardnesses and thicknesses. Our line of Thermal Gap Filler materials have been designed to achieve desired thermal resistance between electrical components in today’s advanced electronics designs.

Typical Properties of This Materials:

Note: Standard Roll Form: 300mm(W) x 50m (L) or 76M (L) , Custom configuration Available

Below info will be helpful for your right application

How to transfer or dissipate the heat from the heat-generating components to heat sinks?

How To Select the Right Thermal Interface Materials for your new application?

Pls feel free to contact us as Thermal Management Solutions available in SinoGuide.

Any information contained herein is believed to be accurate and reliable. SinoGuide and its agents does not assume any responsibility or liability for any advice furnished by it, or for the performance or results of any installation or use of the product(s) or of any final products into which the product(s) may be incorporated by the purchaser and/or user. The purchaser and/or user should perform its own tests to determine the suitability and fitness of the product (s) for the particular purpose desired in any given situation.