Ultra-soft Thermal Interface Material with Good EMI Absorption from Sinoguide Technology

With one side fiberglass reinforced at thermal conductivity of 1.1 W/m-K and excellent EMI absorption, Sinoguide TCP110U provides robust thermal management control and an added level of EMI protection.

Sinoguide Technology has already brought the first-ever extremely low stress thermal interface material that unites thermal conductivity with satisfied EMI absorption capabilities. In its line of thermal pad product, Sinoguide TCP110U Gap Pad offers electronic specialists critical heat and electromagnetic energy control in a flexible, air voids filling material designed to show exceptionally low stress and ultra-softness.

Thermal interface materials have long been recognized as the market's most effective thermal management products to fill unique and intricate air voids and gaps. Now, these trusted materials take device protection one step further by integrating electromagnetic energy absorption functionality.  With thermal conductivity of 1.1 W/m-K and satisfied EMI absorption, TCP110U provides robust thermal management control and an added level of EMI protection.

TCP110U improved wet-out at the interface results in thermal performance that is superior to other competitive materials with a similar grade.  Thermal conductivity is also enhanced by the material's natural tack on one side, which eliminates the requirement for any thermally-impeding adhesive layers and also makes component rework simple. With another side fiberglass reinforced, it is highly improved on puncture, shear and tear resistance.

Not only does TCP110U technology offer superb thermal and EMI performance, but the material is the softest and most compliant on the market.  Its ability to conform to various topographies and provide a high degree of flexibility ensures exceptionally low stress on solder joints.  As compared to traditional EMI materials with high modulus, TCP110U helps improve reliability by reducing in-field failures caused by solder joint stress and fractures.

Supplied in both sheet and die-cut formats, TCP110U is available in various thicknesses and customized shape and can be applied manually or by automated placement.