This high performance thermal pad has thermal conductivity similar to thermal grease but without the mess. A thermal pad is used between a module’s baseplate and an attached heat sink to minimize the thermal impedance between them.
◇Thermally conductive insulators are designed to be clean, grease-free, flexible and convenient assembly .The combination of a tough carrier material such as fiberglass or Polyimide and silicone rubber which is conformable, minimize the thermal resistance from the case of a power semiconductor such as MOSFET to the heat sink.◇All TCI materials electrically isolate the semiconductor from the heat sink and have sufficient dielectric strength to withstand high voltage. They are also strong enough to resist puncture by the facing metal surface by screw driver and clip mounted application
Typical Applications Include:
--Between high power component (such as MOSFET) and heatsink for screw and clip mounted application
--Graphic Processor Unit
--Digital/High Power CPU's
Typical Properties of This Materials:
|Typical Properties of Thermal Conductive Insulator|
|Hardness||Shore A||80||80||80||ASTM D2240|
|Thermal Resistance||@50psi (℃-in2/W)||0.021||0.014||0.009||ASTM D5470|
|Temperature Range||℃||-50 to 200||EN344|
|Breakdown Voltage||KV||≥4.8||≥5.0||≥5.0||ASTM D149|
|Dielectric Constant||60 HZ||3.6||3.75||6.6||ASTM D150|
|Dielectric Constant||1K Hz||3.5||3.7||6.6||ASTM D150|
|Dielectric Constant||1M Hz||3.5||1.8||6.6||ASTM D150|
|Thermal Conductivity||W/m.k||1.6||1.3||1.6||ASTM D5470|
Note: Standard Roll Form: 300mm(W) x 50m (L) or 76M (L) , Custom configuration Available
Below info will be helpful for your right application
How to transfer or dissipate the heat from the heat-generating components to heat sinks?
How To Select the Right Thermal Interface Materials for your new application?
Pls feel free to contact us as Thermal Management Solutions available in SinoGuide.
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