Acrylic Silicone Free Thermal Pad
- Brand Name: SinoGuide
- Model Number: TCSF200
- Material: Acrylic&Ceramic
- Thermal Conductivity: 2.0 W/m.k
- Material Details：Thermal Pad: Ultra-Soft Silicone Free from SinoGuide; 2.00 W/mk thermal conductivity; Naturally tacky for easy applicaiton; Electrically insulating. MATERIAL HIGHLIGHT: SinoGuide™ THERMALLY CONDUCTIVE
In computing and electronics, thermal pads (also called thermally conductive pads or thermal interface pads) are a pre-formed square or rectangle of solid material (often ceramic or silicone based) commonly found on the underside of heat sinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminum or copper).
The SinoGuide™ Thermally Conductive Pads are available in acrylic, where a non-silicone base material is desired. The pads are designed in a variety of thermal conductivities and softness grades to provide excellent gap filling, low assembled stress and a high degree of wet-out for a more efficient heat transfer.
Typical Properties of This Materials:
|Typical Properties of TCSF200 Silicone-Free Thermal Conductive Pad|
|Properties||Units||TCSF200 Series||Test Method|
|Thickness||mm||0.5 to 5||---|
|Hardness||Shore 00||60||ASTM D2240|
|Heat Capacity||1/g-K||1.1||ASTM E1269|
|Outgassing TML||---||0.12%||ASTM E595|
|Outgassing CVCM||---||0.06%||ASTM E595|
|Continuous Use Temp||℃||-60 to 200||EN344|
|Dielectric Breakdown Voltage||Vac||≥200 Vac/mil||ASTM D149|
|Volume Impedance||ohm-cm||6.0 x109||ASTM D257|
|Flame Rating||V 0||UL 94|
|Thermal Conductivity||W/m.k||2.0||ASTM D5470|
Note: Standard Roll Form: 300mm(W) x 50m (L) or 76M (L) , Custom configuration Available
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